单相定时同步的PWM控制器CXSD62102驱动N通道mosfet瞬态响应和准确的直流电压以PFM或PWM模式输出

发布时间:2020-04-22 16:03:13 浏览次数:349 作者:oumao18 来源:嘉泰姆
摘要:CXSD62102提供出色的瞬态响应和准确的直流电压以PFM或PWM模式输出。在脉冲频率模式(PFM)中,CXSD62102在轻到重负载的负载下提供非常高的效率-调制开关频率。在脉宽调制模式下,转换器几乎在用于低噪声要求的恒定频率
单相定时同步的PWM控制器CXSD62102驱动N通道mosfet瞬态响应和准确的直流电压以PFM或PWM模式输出

目录efT嘉泰姆

1.产品概述                       2.产品特点efT嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 efT嘉泰姆
5.产品封装图                     6.电路原理图                   efT嘉泰姆
7.功能概述                        8.相关产品efT嘉泰姆

一,产品概述(General Description)         efT嘉泰姆
            The CXSD62102 is a single-phase, constant on-time, synchronous PWMefT嘉泰姆
controller, which drives N-channel MOSFETs. The CXSD62102 steps down highefT嘉泰姆
voltage to generate low-voltage chipset or RAM supplies in notebook computers.efT嘉泰姆
The CXSD62102 provides excellent transient response and accurate DC voltageefT嘉泰姆
output in either PFM or PWM Mode.In Pulse Frequency Mode (PFM), theCXSD62102 provides very high efficiency over light to heavy loads with loading-efT嘉泰姆
modulated switching frequencies. In PWM Mode, the converter works nearly atefT嘉泰姆
constant frequency for low-noise requirements. CXSD62102 is built in remoteefT嘉泰姆
sense function for applications that require remote sense.The CXSD62102 isefT嘉泰姆
equipped with accurate positive current limit, output under-voltage, and outputefT嘉泰姆
over-voltage protections, perfect for NB applications. The Power-On-ResetefT嘉泰姆
function monitors the voltage on VCC to prevent wrong operation duringefT嘉泰姆
power-on. The CXSD62102 has a 1ms digital soft start and built-in an integratedefT嘉泰姆
output discharge device for soft stop. An internal integrated soft-start ramps upefT嘉泰姆
the output voltage with programmable slew rate to reduce the start-up current.efT嘉泰姆
A soft-stop function actively discharges the output capacitors.efT嘉泰姆
       The CXSD62102 is available in 16pin TQFN3x3-16 package respectively.efT嘉泰姆
二.产品特点(Features)efT嘉泰姆
1.)Adjustable Output Voltage from +0.6V to +3.3VefT嘉泰姆
      - 0.6V Reference VoltageefT嘉泰姆
      - ±0.6% Accuracy Over-TemperatureefT嘉泰姆
2.)Operates from An Input Battery Voltage Range of +1.8V to +28VefT嘉泰姆
3.)Remote Feedback Sense for Excellent Output VoltageefT嘉泰姆
4.)REFIN Function for Over-clocking Purpose from 0.5V~2.5V rangeefT嘉泰姆
5.)Power-On-Reset Monitoring on VCC pinefT嘉泰姆
6.)Excellent line and load transient responsesefT嘉泰姆
7.)PFM mode for increased light load efficiencyefT嘉泰姆
8.)Programmable PWM Frequency from 100kHz to 500kHzefT嘉泰姆
9.)Selectable Forced PWM or automatic PFM/PWM modeefT嘉泰姆
10.)Built in 30A Output current driving capabilityIntegrate MOSFET DriversefT嘉泰姆
11.)Integrated Bootstrap Forward P-CH MOSFETefT嘉泰姆
12.)Adjustable Integrated Soft-Start and Soft-Stop Power Good MonitoringefT嘉泰姆
13.)70% Under-Voltage ProtectionefT嘉泰姆
14.)125% Over-Voltage Protection TQFN3x3-16 PackageefT嘉泰姆
15.)Lead Free and Green Devices AvailableefT嘉泰姆
三,应用范围 (Applications)efT嘉泰姆
NotebookefT嘉泰姆
Table PCefT嘉泰姆
Hand-Held PortableefT嘉泰姆
AIO PCefT嘉泰姆
四.下载产品资料PDF文档 efT嘉泰姆

需要详细的PDF规格书请扫一扫微信联系我们,还可以获得免费样品以及技术支持efT嘉泰姆

 QQ截图20160419174301.jpgefT嘉泰姆

五,产品封装图 (Package)efT嘉泰姆

blob.pngefT嘉泰姆

六.电路原理图efT嘉泰姆


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七,功能概述efT嘉泰姆


Input Capacitor Selection (Cont.)efT嘉泰姆
higher than the maximum input voltage. The maximum RMS current rating requirement is approximately IOUT/2,where IOUT is the load current. During power-up, the input capacitors have to handle great amount of surge current.For low-duty notebook appliactions, ceramic capacitor is recommended. The capacitors must be connected be-tween the drain of high-side MOSFET and the source of low-side MOSFET with very low-impeadance PCB layout. efT嘉泰姆
MOSFET SelectionefT嘉泰姆
The application for a notebook battery with a maximum voltage of 24V, at least a minimum 30V MOSFETs shouldefT嘉泰姆
be used. The design has to trade off the gate charge with the RDS(ON) of the MOSFET:For the low-side MOSFET, before it is turned on, the body diode has been conducting. The low-side MOSFET driver will not charge the miller capacitor of this MOSFET.efT嘉泰姆
In the turning off process of the low-side MOSFET, the load current will shift to the body diode first. The high dv/dt of the phase node voltage will charge the miller capaci-tor through the low-side MOSFET driver sinking current path. This results in much less switchingefT嘉泰姆
loss of the low-side MOSFETs. The duty cycle is often very small in high battery voltage applications, and the low-side MOSFET will conduct most of the switching cycle; therefore, when using smaller RDS(ON) of the low-side MOSFET, the con-verter can reduce power loss. The gate charge for this MOSFET is usually the secondary consideration. The high-side MOSFET does not have this zero voltage switch-ing condition; in addition, it conducts for less time com-pared to the low-side MOSFET, so the switching loss tends to be dominant. Priority should be given to the MOSFETs with less gate charge, so that both the gate driver loss and switching loss will be minimized.efT嘉泰姆
The selection of the N-channel power MOSFETs are determined by the R DS(ON), reversing transfer capaci-tance (CRSS) and maximum output current requirement.The losses in the MOSFETs have two components:efT嘉泰姆
conduction loss and transition loss. For the high-side and low-side MOSFETs, the losses are approximatelyefT嘉泰姆
given by the following equations:efT嘉泰姆
Phigh-side = IOUT (1+ TC)(RDS(ON))D + (0.5)( IOUT)(VIN)( tSW)FSWefT嘉泰姆
Plow-side = IOUT (1+ TC)(RDS(ON))(1-D) is the load current TC is the temperature dependency of RDS(ON)efT嘉泰姆
FSW is the switching frequency tSW is the switching interval D is the duty cycleNote that both MOSFETs have conduction losses while the high-side MOSFET includes an additional transition loss.The switching interval, tSW, is the function of the reverse transfer capacitance CRSS. The (1+TC) term is a factor in the temperature dependency of the RDS(ON) and can be extracted from the “RDS(ON) vs. Temperature” curve of the power MOSFET.efT嘉泰姆
Layout ConsiderationefT嘉泰姆
In any high switching frequency converter, a correct layout is important to ensure proper operation of the regulator.efT嘉泰姆
With power devices switching at higher frequency, the resulting current transient will cause voltage spike acrossefT嘉泰姆
the interconnecting impedance and parasitic circuit elements. As an example, consider the turn-off transitionefT嘉泰姆
of the PWM MOSFET. Before turn-off condition, the MOSFET is carrying the full load current. During turn-off,efT嘉泰姆
current stops flowing in the MOSFET and is freewheeling by the low side MOSFET and parasitic diode. Any parasiticefT嘉泰姆
inductance of the circuit generates a large voltage spike during the switching interval. In general, using short andefT嘉泰姆
wide printed circuit traces should minimize interconnect-ing impedances and the magnitude of voltage spike.efT嘉泰姆
Besides, signal and power grounds are to be kept sepa-rating and finally combined using ground plane construc-efT嘉泰姆
tion or single point grounding. The best tie-point between the signal ground and the power ground is at the nega-efT嘉泰姆
tive side of the output capacitor on each channel, where there is less noise. Noisy traces beneath the IC are notefT嘉泰姆

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