5A同步降压转换器CXSD62122 50mΩ P沟道功率MOSFET和20mΩ N沟道功率MOSFET电流模式控制方案

目录hdH嘉泰姆

1.产品概述                       2.产品特点hdH嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 hdH嘉泰姆
5.产品封装图                     6.电路原理图                   hdH嘉泰姆
7.功能概述                        8.相关产品hdH嘉泰姆

一,产品概述(General Description)   hdH嘉泰姆

  The CXSD62122 is a 5A, synchronous, step-down converter with integrated 50mΩ P-channel power MOSFET and 20mΩ N-channel power MOSFET.The device, with cur-rent-mode control scheme, can convert 4.5~26V input volt-age to the output voltage adjustable from 0.8 to 90% VIN to provide excellent output voltage regulation.hdH嘉泰姆
  The CXSD62122 regulates the output voltage in an auto-matic PSM/PWM mode operation, depending on the out-put current, for high efficiency operation over light to full load current. The CXSD62122 is also equipped with power-hdH嘉泰姆
on-reset, soft-start, and whole protections (including over- voltage, under-voltage, over-temperature, and current-limit) in a single package. In shutdown mode, the supply current drops below 5μA.This device, available in 28-pin TQFN5x6 package, pro-vides a very compact system solution with minimal exter-hdH嘉泰姆
nal components and good thermal conductance.hdH嘉泰姆
二.产品特点(Features)hdH嘉泰姆

Wide Input Voltage from 4.5V to 26VhdH嘉泰姆
Output Current Up to 5AhdH嘉泰姆
Adjustable Output Voltage from 0.8V to 90%VINhdH嘉泰姆
- 0.8V Reference VoltagehdH嘉泰姆
- ±2.5% System AccuracyhdH嘉泰姆
Integrated 50mΩ P-Channel Power MOSFET andhdH嘉泰姆
20mΩ N-Channel Power MOSFEThdH嘉泰姆
High Efficiency up to 95%hdH嘉泰姆
Current-Mode OperationhdH嘉泰姆
- Stable with Ceramic Output CapacitorshdH嘉泰姆
- Fast Transient ResponsehdH嘉泰姆
Power-On-Reset MonitoringhdH嘉泰姆
Fixed 380kHz Switching Frequency in PWM ModehdH嘉泰姆
Automatic Pulse-Skipping Mode (PSM)/PWMhdH嘉泰姆
Mode OperationhdH嘉泰姆
Built-in Digital Soft-StarthdH嘉泰姆
Output Current-Limit Protection with FrequencyhdH嘉泰姆
FoldbackhdH嘉泰姆
·70% Under-Voltage ProtectionhdH嘉泰姆
·Over-Temperature ProtectionhdH嘉泰姆
·118% Over-Voltage ProtectionhdH嘉泰姆
·<5μA Quiescent Current During ShutdownhdH嘉泰姆
·Thermal-Enhanced TQFN5x6-28 PackagehdH嘉泰姆
·Pb-Free Available as an OptionhdH嘉泰姆
·Lead Free and Green Devices AvailablehdH嘉泰姆
(RoHS Compliant)hdH嘉泰姆
三,应用范围 (Applications)hdH嘉泰姆

LCD Monitor / TVhdH嘉泰姆

SetTop BoxhdH嘉泰姆
Portable DVDhdH嘉泰姆
Wireless LANhdH嘉泰姆
ADSL, Switch HUBhdH嘉泰姆
Notebook ComputerhdH嘉泰姆
Step-Down Converters Requiring High EfficiencyhdH嘉泰姆
and 5A Output CurrenthdH嘉泰姆

四.下载产品资料PDF文档 hdH嘉泰姆

需要详细的PDF规格书请扫一扫微信联系我们，还可以获得免费样品以及技术支持！hdH嘉泰姆

 hdH嘉泰姆

五,产品封装图 (Package)hdH嘉泰姆

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六.电路原理图hdH嘉泰姆

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七,功能概述hdH嘉泰姆

Inductor Value CalculationhdH嘉泰姆
The operating frequency and inductor selection are inter-related in that higher operating frequencies permithdH嘉泰姆

the use of a smaller inductor for the same amount of inductor ripple current. However, this is at the expensehdH嘉泰姆

 of efficiency due to an increase in MOSFET gate charge losses. The equation (2) shows that the inductancehdH嘉泰姆

value has a direct effect on ripple current.Accepting larger values of ripple current allows the use of lowhdH嘉泰姆

 inductances, but results in higher output voltage ripplehdH嘉泰姆
Layout ConsiderationhdH嘉泰姆
In high power switching regulator, a correct layout is im-portant to ensure proper operation of the regulator.hdH嘉泰姆

In general, interconnecting impedance should be minimized by using short, wide printed circuit traces. SignalhdH嘉泰姆

 and power grounds are to be kept separating and finally com-bined using ground plane construction or singlehdH嘉泰姆

 point grounding. Figure 2 illustrates the layout, with bold lines indicating high current paths. ComponentshdH嘉泰姆

 along the bold lines should be placed close together. The following is a checklist for your layout:hdH嘉泰姆
1. Firstly, to initial the layout by placing the power components. Orient the power circuitry to achieve a cleanhdH嘉泰姆
power flow path. If possible, make all the connections on one side of the PCB with wide, copper filled areas.hdH嘉泰姆
2. In Figure 2, the loops with the same color bold lines conduct high slew rate current. These interconnectinghdH嘉泰姆
impedances should be minimized by using wide, short printed circuit traces.hdH嘉泰姆
3. Keep the sensitive small signal nodes (FB, COMP) away from switching nodes (LX or others) on the PCB.hdH嘉泰姆
Therefore, place the feedback divider and the feedback compensation network close to the IC to avoid switchinghdH嘉泰姆
noise. Connect the ground of feedback divider directly to the GND pin of the IC using a dedicated ground trace.hdH嘉泰姆
4. The VCC decoupling capacitor should be right next to the VCC and GND pins. Capacitor C2 should be connectedhdH嘉泰姆
as close to the VIN and UGND pins as possible.hdH嘉泰姆
5. Place the decoupling ceramic capacitor C1 near the VIN as close as possible. The bulk capacitors C8 are alsohdH嘉泰姆
placed near VIN. Use a wide power ground plane to con- nect the C1, C8, and C4 to provide a low impedancehdH嘉泰姆
八,相关产品                 更多同类产品.......hdH嘉泰姆