单相定时同步的PWM控制器CXSD62102驱动N通道mosfet瞬态响应和准确的直流电压以PFM或PWM模式输出

发布时间:2020-04-22 16:03:13 浏览次数:328 作者:oumao18 来源:嘉泰姆
摘要:CXSD62102提供出色的瞬态响应和准确的直流电压以PFM或PWM模式输出。在脉冲频率模式(PFM)中,CXSD62102在轻到重负载的负载下提供非常高的效率-调制开关频率。在脉宽调制模式下,转换器几乎在用于低噪声要求的恒定频率
单相定时同步的PWM控制器CXSD62102驱动N通道mosfet瞬态响应和准确的直流电压以PFM或PWM模式输出

目录MXz嘉泰姆

1.产品概述                       2.产品特点MXz嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 MXz嘉泰姆
5.产品封装图                     6.电路原理图                   MXz嘉泰姆
7.功能概述                        8.相关产品MXz嘉泰姆

一,产品概述(General Description)         MXz嘉泰姆
            The CXSD62102 is a single-phase, constant on-time, synchronous PWMMXz嘉泰姆
controller, which drives N-channel MOSFETs. The CXSD62102 steps down highMXz嘉泰姆
voltage to generate low-voltage chipset or RAM supplies in notebook computers.MXz嘉泰姆
The CXSD62102 provides excellent transient response and accurate DC voltageMXz嘉泰姆
output in either PFM or PWM Mode.In Pulse Frequency Mode (PFM), theCXSD62102 provides very high efficiency over light to heavy loads with loading-MXz嘉泰姆
modulated switching frequencies. In PWM Mode, the converter works nearly atMXz嘉泰姆
constant frequency for low-noise requirements. CXSD62102 is built in remoteMXz嘉泰姆
sense function for applications that require remote sense.The CXSD62102 isMXz嘉泰姆
equipped with accurate positive current limit, output under-voltage, and outputMXz嘉泰姆
over-voltage protections, perfect for NB applications. The Power-On-ResetMXz嘉泰姆
function monitors the voltage on VCC to prevent wrong operation duringMXz嘉泰姆
power-on. The CXSD62102 has a 1ms digital soft start and built-in an integratedMXz嘉泰姆
output discharge device for soft stop. An internal integrated soft-start ramps upMXz嘉泰姆
the output voltage with programmable slew rate to reduce the start-up current.MXz嘉泰姆
A soft-stop function actively discharges the output capacitors.MXz嘉泰姆
       The CXSD62102 is available in 16pin TQFN3x3-16 package respectively.MXz嘉泰姆
二.产品特点(Features)MXz嘉泰姆
1.)Adjustable Output Voltage from +0.6V to +3.3VMXz嘉泰姆
      - 0.6V Reference VoltageMXz嘉泰姆
      - ±0.6% Accuracy Over-TemperatureMXz嘉泰姆
2.)Operates from An Input Battery Voltage Range of +1.8V to +28VMXz嘉泰姆
3.)Remote Feedback Sense for Excellent Output VoltageMXz嘉泰姆
4.)REFIN Function for Over-clocking Purpose from 0.5V~2.5V rangeMXz嘉泰姆
5.)Power-On-Reset Monitoring on VCC pinMXz嘉泰姆
6.)Excellent line and load transient responsesMXz嘉泰姆
7.)PFM mode for increased light load efficiencyMXz嘉泰姆
8.)Programmable PWM Frequency from 100kHz to 500kHzMXz嘉泰姆
9.)Selectable Forced PWM or automatic PFM/PWM modeMXz嘉泰姆
10.)Built in 30A Output current driving capabilityIntegrate MOSFET DriversMXz嘉泰姆
11.)Integrated Bootstrap Forward P-CH MOSFETMXz嘉泰姆
12.)Adjustable Integrated Soft-Start and Soft-Stop Power Good MonitoringMXz嘉泰姆
13.)70% Under-Voltage ProtectionMXz嘉泰姆
14.)125% Over-Voltage Protection TQFN3x3-16 PackageMXz嘉泰姆
15.)Lead Free and Green Devices AvailableMXz嘉泰姆
三,应用范围 (Applications)MXz嘉泰姆
NotebookMXz嘉泰姆
Table PCMXz嘉泰姆
Hand-Held PortableMXz嘉泰姆
AIO PCMXz嘉泰姆
四.下载产品资料PDF文档 MXz嘉泰姆

需要详细的PDF规格书请扫一扫微信联系我们,还可以获得免费样品以及技术支持MXz嘉泰姆

 QQ截图20160419174301.jpgMXz嘉泰姆

五,产品封装图 (Package)MXz嘉泰姆

blob.pngMXz嘉泰姆

六.电路原理图MXz嘉泰姆


blob.pngMXz嘉泰姆
blob.pngMXz嘉泰姆

七,功能概述MXz嘉泰姆


Input Capacitor Selection (Cont.)MXz嘉泰姆
higher than the maximum input voltage. The maximum RMS current rating requirement is approximately IOUT/2,where IOUT is the load current. During power-up, the input capacitors have to handle great amount of surge current.For low-duty notebook appliactions, ceramic capacitor is recommended. The capacitors must be connected be-tween the drain of high-side MOSFET and the source of low-side MOSFET with very low-impeadance PCB layout. MXz嘉泰姆
MOSFET SelectionMXz嘉泰姆
The application for a notebook battery with a maximum voltage of 24V, at least a minimum 30V MOSFETs shouldMXz嘉泰姆
be used. The design has to trade off the gate charge with the RDS(ON) of the MOSFET:For the low-side MOSFET, before it is turned on, the body diode has been conducting. The low-side MOSFET driver will not charge the miller capacitor of this MOSFET.MXz嘉泰姆
In the turning off process of the low-side MOSFET, the load current will shift to the body diode first. The high dv/dt of the phase node voltage will charge the miller capaci-tor through the low-side MOSFET driver sinking current path. This results in much less switchingMXz嘉泰姆
loss of the low-side MOSFETs. The duty cycle is often very small in high battery voltage applications, and the low-side MOSFET will conduct most of the switching cycle; therefore, when using smaller RDS(ON) of the low-side MOSFET, the con-verter can reduce power loss. The gate charge for this MOSFET is usually the secondary consideration. The high-side MOSFET does not have this zero voltage switch-ing condition; in addition, it conducts for less time com-pared to the low-side MOSFET, so the switching loss tends to be dominant. Priority should be given to the MOSFETs with less gate charge, so that both the gate driver loss and switching loss will be minimized.MXz嘉泰姆
The selection of the N-channel power MOSFETs are determined by the R DS(ON), reversing transfer capaci-tance (CRSS) and maximum output current requirement.The losses in the MOSFETs have two components:MXz嘉泰姆
conduction loss and transition loss. For the high-side and low-side MOSFETs, the losses are approximatelyMXz嘉泰姆
given by the following equations:MXz嘉泰姆
Phigh-side = IOUT (1+ TC)(RDS(ON))D + (0.5)( IOUT)(VIN)( tSW)FSWMXz嘉泰姆
Plow-side = IOUT (1+ TC)(RDS(ON))(1-D) is the load current TC is the temperature dependency of RDS(ON)MXz嘉泰姆
FSW is the switching frequency tSW is the switching interval D is the duty cycleNote that both MOSFETs have conduction losses while the high-side MOSFET includes an additional transition loss.The switching interval, tSW, is the function of the reverse transfer capacitance CRSS. The (1+TC) term is a factor in the temperature dependency of the RDS(ON) and can be extracted from the “RDS(ON) vs. Temperature” curve of the power MOSFET.MXz嘉泰姆
Layout ConsiderationMXz嘉泰姆
In any high switching frequency converter, a correct layout is important to ensure proper operation of the regulator.MXz嘉泰姆
With power devices switching at higher frequency, the resulting current transient will cause voltage spike acrossMXz嘉泰姆
the interconnecting impedance and parasitic circuit elements. As an example, consider the turn-off transitionMXz嘉泰姆
of the PWM MOSFET. Before turn-off condition, the MOSFET is carrying the full load current. During turn-off,MXz嘉泰姆
current stops flowing in the MOSFET and is freewheeling by the low side MOSFET and parasitic diode. Any parasiticMXz嘉泰姆
inductance of the circuit generates a large voltage spike during the switching interval. In general, using short andMXz嘉泰姆
wide printed circuit traces should minimize interconnect-ing impedances and the magnitude of voltage spike.MXz嘉泰姆
Besides, signal and power grounds are to be kept sepa-rating and finally combined using ground plane construc-MXz嘉泰姆
tion or single point grounding. The best tie-point between the signal ground and the power ground is at the nega-MXz嘉泰姆
tive side of the output capacitor on each channel, where there is less noise. Noisy traces beneath the IC are notMXz嘉泰姆

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