2.6V至6.5V输入电源VGON和VGOFF的线性调节器控制器CXSU63137电流模式升压调节器大电流运算放大器

2.6V至6.5V输入电源VGON和VGOFF的线性调节器控制器CXSU63137电流模式升压调节器大电流运算放大器

产品型号：CXSU63137
产品类型：DC-DC转换器
产品系列： DC升压转换
产品状态：量产
浏览次数：39 次
加入收藏

产品简介

CXSU63137集成了一个高性能升压转换器、两个线性调节器控制器、一个高压开关和一个（CXSU63137）、三个（CXSU63137）或五个（CXSU63137）大电流运算放大器，用于TFT-LCD应用。主升压调节器是电流模式、固定频率的PWM开关调节器。1.2兆赫的开关频率允许使用低剖面感应器和陶瓷电容器，以最小化液晶面板设计的厚度

技术参数

输入电压范围 (VIN)≤ 2.5~6.5V
输出电压 (VOUT)2.5~18V
输出电流 (IOUT)3A
工作频率1200Hz
转换效率93%%
封装类型TSOT25 TDFN2x2-6
Topology Boost DC升压转换
Control methodPWM/PFM
Switching frequency1200
ProtectionAuto-recovery
Features Fixed Output Voltage (V):No
ApplicationInternal Power Switch :Yes
Operating temp-40℃~125℃
Reference designSync. Rectifier:No
Precision±2%

产品详细介绍

目录

1.产品概述                       2.产品特点
3.应用范围                       4.下载产品资料PDF文档 
5.产品封装图                     6.电路原理图                   
7.功能概述                        8.相关产品

一,产品概述(General Description)         

           The CXSU63137 integrates with a high-performance step-up converter, two linear-regulator controllers, a high voltage switch and one (CXSU63137), three (CXSU63137) or five (CXSU63137) high current operational amplifiers for TFT-LCD applications.The main step-up regulator is a current-mode, fixed-fre-quency PWM switching regulator. The 1.2MHz switching frequency allows the usage of low-profile inductors and ceramic capacitors to minimize the thickness of LCD panel designs.
      The linear-regulator controllers used external transistors provide regulated the gate-driver of TFT-LCD VGON and VGOFF supplies.
The amplifiers are ideal for VCOM and VGAMMA applications, with
150m A peak output current drive, 10MHz bandwidth, and 13V/μs slew
rate. All inputs and outputs are rail-to-rail.
     The CXSU63137/1/2 is available in a tiny 5mm x 5mm 32-pin QFN package (TQFN5x5-32).
二.产品特点(Features)

· 2.6V to 6.5V Input Supply Range 

· Current-Mode Step-Up Regulator 

 - Fast Transient Response 

 - 1.2MHz Fixed Operating Frequency 

· ±1.5% High-Accuracy Output Voltage 

· 3A, 20V, 0.25W Internal N-Channel MOSFET 

· High Efficiency 

· Low Quiescent Current (0.6mA Typical) 

· Linear-Regulator Controllers for VGON and VGOFF 

· High-performance Operational Amplifiers 

 - ±150mA Output Short-Circuit Current

 - 13V/ms Slew Rate - 10MHz, -3dB Bandwidth 

 - Rail-to-Rail Inputs/Outputs 

· Fault-Delay Timer and Fault Latch for All Regulator Outputs 

· Over-Temperature Protection 

· Available in Compact 32-pin 5mmx5mm Thin QFN Package (TQFN5x5-32) 

· Lead Free Available (RoHS Compliant)

三,应用范围 (Applications)

    TFT LCD Displays for Monitors
   TFT LCD Displays for Notebook Computers
   Automotive Displays
四.下载产品资料PDF文档 

需要详细的PDF规格书请扫一扫微信联系我们，还可以获得免费样品以及技术支持！

 QQ截图20160419174301.jpg

五,产品封装图 (Package)

blob.png
blob.pngPin Function Description

Pin

Name

Function Description

CXSU63137

CXSU63137-1

CXSU63137-2

1

SRC

SRC

SRC

Switch Input. Source of the internal high-voltage P-channel MOSFET. Bypass
SRC to PGND with a minimum of 0.1μF capacitor closed to the pins.

2

REF

REF

REF

Reference voltage output. Bypass REF to AGND with a minimum of
0.22μFcapacitor closed to the pins.

3

AGND

AGND

AGND

Analog Ground for Step-Up Regulator and Linear Regulators. Connect to
power ground (PGND) underneath the IC.

4

PGND

PGND

PGND

Power Ground for Step-Up Regulator. PGND is the source of the main step-up
n-channel power MOSFET. Connect PGND to the ground terminals of output
capacitors through a short, wide PC board trace. Connect to analog ground
(AGND) underneath the IC.

5

OUT1

OUT1

OUT1

Output of Operational-Amplifier 1

6

NEG1

NEG1

NEG1

Inverting Input of Operational-Amplifier 1

7

POS1

POS1

POS1

Non-inverting Input of Operational-Amplifier 1

8

NC

OUT2

OUT2

Output of Operational-Amplifier 2 of CXSU63137/CXSU63137. No internal
connected of CXSU63137.

9

NC

NEG2

NEG2

Inverting Input of Operational-Amplifier 2 of CXSU63137/CXSU63137. No internal
connected of CXSU63137.

10

IC

POS2

POS2

Non-inverting Input of Operational-Amplifier 2 of CXSU63137/CXSU63137. Internal
connected to GND of CXSU63137

11

BGND

BGND

BGND

Analog Ground for Operational Amplifiers. Connect to power ground (PGND)
underneath the IC.

12

NC

NC

POS3

Non-inverting Input of Operational-Amplifier 3 of CXSU63137. No internal
connected of CXSU63137/CXSU63137.

13

NC

NC

OUT3

Output of Operational-Amplifier 3 of CXSU63137. No internal connected ofCXSU63137/CXSU63137.

14

SUP

SUP

SUP

Power Input of Operational Amplifiers. Typically connected to VMAIN. Bypass
SUP to BGND with a 0.1μF capacitor.

15

NC

POS3

POS4

Non-inverting Input of Operational-Amplifier 4 of CXSU63137. Non-inverting
Input of Operational-Amplifier 3 of CXSU63137. No internal connected ofCXSU63137.

16

NC

NEG3

NEG4

Inverting Input of Operational-Amplifier 4 of CXSU63137. Inverting Input of
Operational-Amplifier 3 of CXSU63137. No internal connected of CXSU63137.

17

NC

OUT3

OUT4

Output of Operational-Amplifier 4 of CXSU63137. Output of
Operational-Amplifier 3 of CXSU63137. No internal connected of CXSU63137.

18

IC

IC

POS5

Non-inverting Input of Operational-Amplifier 5 of CXSU63137. Internal connected
to GND of CXSU63137/CXSU63137.

19

NC

NC

NEG5

Inverting Input of Operational-Amplifier 5 of CXSU63137. No internal connected
of CXSU63137/CXSU63137.

20

NC

NC

OUT5

Output of Operational-Amplifier 5 of CXSU63137. No internal connected ofCXSU63137/CXSU63137.

21

LX

LX

LX

N-Channel Power MOSFET Drain and Switching Node. Connect the inductor
and Schottky diode to LX and minimize the trace area for lowest EMI.

22

IN

IN

IN

Supply Voltage Input. Bypass IN to AGND with a 0.1μF capacitor. IN can range
from 2.6V to 6.5V.

23

FB

FB

FB

Step-Up Regulator Feedback Input. Connect a resistive voltage-divider from
the output (VMAIN) to FB to analog ground (AGND). Place the divider within
5mm of FB.

24

COMP

COMP

COMP

Step-Up Regulator Error-Amplifier Compensation Point. Connect a series RC
from COMP to AGND.

PinFunction Description

Pin

Name

Function Description

CXSU63137

CXSU63137-1

CXSU63137-2

24

COMP

COMP

COMP

Step-Up Regulator Error-Amplifier Compensation Point. Connect a series RC
from COMP to AGND.

25

FBP

FBP

FBP

Gate-On Linear-Regulator Feedback Input. Connect FBP to the center of a
resistive voltage-divider between the regulator output and AGND to set the
gate-on linear regulator output voltage. Place the resistive voltage-divider
close to the pin.

26

DRVP

DRVP

DRVP

Gate-On Linear-Regulator Base Drive. Open drain of an internal n-channel
MOSFET. Connect DRVP to the base of an external PNP pass transistor.

27

FBN

FBN

FBN

Gate-Off Linear-Regulator Feedback Input. Connect FBN to the center of a
resistive voltage-divider between the regulator output and REF to set the
gate-off linear regulator output voltage. Place the resistive voltage-divider
close to the pin.

28

DRVN

DRVN

DRVN

Gate-Off Linear-Regulator Base Drive. Open drain of an internal p-channel
MOSFET. Connect DRVN to the base of an external NPN pass transistor.

29

DEL

DEL

DEL

High-Voltage Switch Delay Input. Connect a capacitor from DEL to AGND to
set the high-voltage switch startup delay.

30

CTL

CTL

CTL

High-Voltage Switch Control Input. When CTL is high, the high-voltage switch
between COM and SRC is on and the high-voltage switch between COM and
DRN is off. When CTL is low, the high-voltage switch between COM and SRC
is off and the high-voltage switch between COM and DRN is on. CTL is
inhibited by the undervoltage lockout and when the voltage on DEL is less than
1.25V.

31

DRN

DRN

DRN

Switch Input. Drain of the internal high-voltage back-to-back P-channel
MOSFETs connected to COM. Do not allows the voltage on DRN to exceed
VSRC.

32

COM

COM

COM

Internal High-Voltage MOSFET Switch Common Terminal. Do not allow the
voltage on COM to exceed VSRC.

六.电路原理图
七,功能概述
For all switching power supplies, the layout is an impor-tant step in the design; especially at high peak currents and switching frequencies. There are some general guidelines for layout:
1.Place the external power components (the input capacitors, output capacitors, boost inductor and output diodes, etc.) in close proximity to the device.Traces to these components should be kept as short and wide as possible to minimize parasitic inductance and resistance.
2.Place the REF and IN bypass capacitors close to the pins. The ground connection of the IN bypass capacitor should be connected directly to the AGND pin with a wide trace.
3.Create a power ground (PGND) and a signal ground island and connect at only one point. The power ground consisting of the input and output capacitor grounds, PGND pin, and any charge-pump components. Connect all of these together with short, wide traces or a small ground plane. Maxi-mizing the width of the power ground traces im-proves efficiency and reduces output voltage ripple and noise spikes. The analog ground plane (AGND) consisting of the AGND pin, all the feed-back-divider ground connections, the operational-amplifier divider ground connections, the COMP and DEL capacitor ground connections, and the device’s exposed backside pad. Connect the AGND and PGND islands by connecting the PGND pin directly to the exposed backside pad. Make no other connections between these separate ground planes.
4.The feedback network should sense the output volt-age directly from the point of load, and be as far away from LX node as possible.
5.The exposed die plate, underneath the package,should be soldered to an equivalent area of metal on the PCB. This contact area should have mul-tiple via connections to the back of the PCB as well as connections to intermediate PCB layers, if available, to maximize thermal dissipation away from the IC.
6.To minimize the thermal resistance of the package when soldered to a multi-layer PCB, the amount of copper track and ground plane area connected to the exposed die plate should be maximized and spread out as far as possible from the IC. The bot-tom and top PCB areas especially should be maxi-mized to allow thermal dissipation to the surround-ing air.
7.Minimize feedback input track lengths to avoid switching noise pick-up
八,相关产品

Switching Regulator > Boost Converter

 Part_No 

Package

Archi-tecture 

Input 

Voltage    

Max Adj.

Output 

Voltage 

Switch Current Limit (max) 

Fixed 

Output 

Voltage  

Switching 

Frequency 

Internal Power   Switch 

Sync. Rectifier 
 

min

max

min

max

(A)

(V)

(kHz)

  

CXSU63133

SOT89

VM 

0.9

5.5

2.5

5.5

0.5

1.8|2.6|2.8|3

|3.3|3.8|4.5|5

-

No

Yes

CXSU63134

MSOP8|TSSOP8

|SOP8

VM

2.5

5.5

2.5

-

-

-

200 ~ 1000

No

No

CXSU63135

TSSOP8|SOP-8P

VM

1

5.5

2.5

5

1

2.5|3.3

300

Yes

Yes

CXSU63136

SOP8

CM

3

40

1.25

40

1.5

-

33 ~ 100

Yes

No

CXSU63137

TQFN5x5-32

CM

2.5

6.5

2.5

18

3

No

1200

Yes

No

CXSU63138

TSOT23-5

TDFN2x2-6

CM

2.5

6

2.5

20

2

-

1500

Yes

No

CXSU63139

TQFN4x4-6

TDFN3x3-12

CM

1.8

5.5

2.7

5.5

5

-

1.2

Yes

Yes

CXSU63140

SOT23-5

CM

2.5

6

2.5

32

1

-

1000

Yes

No

CXSU63141

TSOT-23-6 

TDFN2x2-8

CM

1.2

5.5

1.8

5.5

1.2

-

1.2

Yes

Yes

 

用户评论

共有条评论
用户名: 密码:
验证码: 匿名发表